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Thermo-electro-mechanical fatigue crack growth simulation in piezoelectric solids using XFEM approach
Published in Elsevier B.V.
Volume: 104
Cracks and multiple voids resulting from manufacturing processes interact with each other and severely affect the fracture phenomenon of piezoelectric components. These geometrical discontinuities degrade the service performance and lower the reliability of the piezoelectric devices. Therefore, the present work predicts fatigue-cracking behavior of piezo-electric structures in existence of multiple geometrical discontinuities under cyclic thermal-electrical-mechanical loads using extended finite element method (XFEM). Thermal interaction integrals approach and Stroh formalism are applied for estimating stress intensity factors (SIFs). Modified hoop SIF criterion has been utilized to predict crack growth direction under quasi-static fatigue loading conditions. © 2019 Elsevier Ltd
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Published in Elsevier B.V.
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