A non-contact, non-destructive technique for the depth profiling of micromachined structures is presented. Based on the mirage or optical-beam deflection method of photothermal spectroscopy, an experimental measurement of a 8 μm step in silicon is given by way of illustration. © 1998 Elsevier Science S.A.

Suneet Tuli

Electrical Engineering

(SoE) School of Engineering

A.B. Bhattacharyya

B.C. Forget

D. Fournier

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