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Bamboo-glue interface thermography for non-destructive testing
S. Chugh, , K. Chatterjee, S. Singh, P. Sudhakar
Published in Kerala Forestry Research Institute
Volume: 8
Issue: 3-4
Pages: 143 - 148
The present work explores the possibility of employing non-destructive testing (NDT) technique of thermal wave imaging, using infrared radiations, to study the interface between bamboo and glue, and gaps in glue application therein. This is a relatively unexplored area as regards bamboo, and thus a novelty, though thermal imaging of detecting glue deficiency in laminated wood has been reported. Active thermography technique using Frequency Modulated Thermal Wave Imaging (FMTWI) has been used to identify frequencies which would give good images of the glue deficiencies.Glue bands and gaps up to 5 mm, could be imaged using lock-in thermography through slivers of 2 mm thickness. The inspection time ranged from 65 s to 350 s depending on the glue type. These findings point to the possibility of using thermal NDT for applications of bamboo and its composites/laminates. © KFRI 2009.
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Published in Kerala Forestry Research Institute
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